smart adhesives: Our lead technologies

 

The material sciences and lead technologies at the core of our innovations

As Bostik has expanded, diversified and innovated, our lead adhesive technologies have evolved with us, addressing the ever-changing needs of our customers.

Today we prioritize three distinct technology platforms: Elastic Bonding (EB), Hot Melt Pressure Sensitive Adhesives (HMPSA) and Polymer Modified Binders (PMB).

This focused expertise has allowed us to develop world-leading chemistries in these areas and a constant stream of smart bonding solutions. 

Lead technology platforms

Elastic Bonding (EB)

Elastic bonds are a family of adhesives that join and seal two individual materials together, allowing for flexibility yet remain very strong. 

Learn more about our elastic bonding adhesives

 

Hot melt pressure sensitive adhesives (HMPSA)

These adhesives provide instant bonds as they solidify by cooling, and remain permanently tacky. 

Learn more about HMPSAs

 

Polymer modified binders (PMB)

Construction products based on polymer modified cementitious binders that provide strong adhesion, flexibility, crack resistance and durability.

Learn more about polymer-modified binders

 

Other Bostik technologies used in formulations

Acrylic, cyanoacrylate, ethylene-vinyl acetate (EVA), epoxy, olefin copolymer, polyamide, silicone, solvent-based, water-based.

The Bostik Smart House

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Bostik to Launch Flexible Packaging Adhesive Innovations at PACK EXPO International

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