Bostik launches Kizen® product line in Asia

Bostik launches Kizen® product line in Asia


Kizen®, the next generation hot melt adhesives for case and carton sealing

Bostik launches Kizen® product line in Australia

Kizen®, the next generation hot melt adhesives for case and carton sealingBostik, a leading global adhesive specialist for industrial, construction and consumer markets, is proud to announce the availability of Kizen®, the next generation of hot melt adhesives for case and carton sealing, in Australia.

The name “Kizen” represents the fusion of Japanese words “Kai”, meaning “change”, and “Zen”, meaning “better”. Based on a water-white technology, Kizen® is designed for ease of use and features strong bond performance, providing packaging manufacturers with comfort, security and efficiency to meet their specific requirements.

“Rapid urbanisation and growth of the middle class in APAC has propelled demand of the industrial adhesives market. Having been in this region for close to 30 years, we at Bostik understand the challenges and opportunities presented customers in meeting with this demand,” said Heidi Wang, Consumer Goods Packaging Business Director, Bostik, Industrial Adhesive, Asia. “This is why we are very excited to be launching the Kizen® product family in the APAC region, so that we could further address various customers’ needs, such as improving operational efficiencies and reducing overall costs.”

There are three products under the Kizen® line – Kizen® FORCE, Kizen® ICE and Kizen® HEAT. All three feature fast set speed, broad processing window, good thermal stability and adhesion to difficult substrates. These advantages enable packaging plants to reduce downtime, consolidate stock keeping units (SKUs), streamline production efficiencies and decrease overall packaging costs.

Kizen® HEAT, ideal for hot fill applications, possesses high heat resistance and is able to maintain performance in shipping conditions exposed to extreme temperatures. Additionally, Kizen® HEAT has passed the IOPP Method T-3006 Heat Resistance Under Stress test and has been approved for use in applications of at least 160°F (71°C) for 24 hours.

Kizen® FORCE is an ideal end of line packaging solution due to its enhanced performance capabilities over current adhesive options, such as EVAs and metallocenes. It possesses outstanding thermal stability, aiding in low maintenance, char-free operations. Additionally, with low viscosity and high specific adhesion, it bonds well to surfaces that are traditionally difficult to bond and offers ultra-precise drops.

The third product, Kizen® ICE, offers strong bonds at freezer temperatures and high adhesion to difficult substrates, such as highly recycled corrugated. It also possesses tailored rheology, which facilitates ultra-precise application and clean cut off. Kizen® ICE’s broad processing window allows it to work well across many production lines, enabling plants to consolidate adhesive SKUs.

Kizen® is a product line under the consumer goods packaging market of Bostik’s Industrial Adhesives business unit. All three products are now available in Southeast Asia, Japan, China, and Australia.

For further information, please visit https://www.bostik.com/.

About Bostik, an Arkema company

Bostik is a leading global adhesive specialist in construction, consumer and industrial markets. For more than a century, it has been developing innovative adhesive solutions that are smarter and more adaptive to the forces that shape daily lives. From cradle to grave, from home to office, Bostik’s smart adhesives can be found everywhere. With annual sales of €2 billion, the company employs 6,000 people and has a presence in more than 50 countries. For the latest information, visit https://www.bostik.com/ 

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