The material sciences and lead technologies at the core of our innovations
As Bostik has expanded, diversified and innovated, our lead adhesive technologies have evolved with us, addressing the ever-changing needs of our customers.
Today we prioritize three distinct technology platforms: Elastic Bonding (EB), Hot Melt Pressure Sensitive Adhesives (HMPSA) and Polymer Modified Binders (PMB).
This focused expertise has allowed us to develop world-leading chemistries in these areas and a constant stream of smart bonding solutions.
Lead technology platforms
Elastic bonds are a family of adhesives that join and seal two individual materials together, allowing for flexibility yet remain very strong.
These adhesives provide instant bonds as they solidify by cooling, and remain permanently tacky.
Construction products based on polymer modified cementitious binders that provide strong adhesion, flexibility, crack resistance and durability.
Our others technologies : Acrylic, cyanoacrylate, ethylene-vinyl acetate (EVA), epoxy, olefin copolymer, polyamide, silicone, solvent-based, water-based.