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TH 2157

TH 2157 is a hot melt adhesive used in the building material market such as membrane lamination.
Product overview
TH 2157 can be applied at temperature around 170-190°C depending on application system and substrate. 
Geographic availability
  • Asia Pacific
  • Oceania
  • Europe

Smart Advantages

 
Good wettability at application temperature: enhanced insulation performances. 
No curing phase: improved line speeds. 
Optimal adhesion on many substrates: adhesion versatility.