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Thermelt 865

Thermelt 865 is a high quality, non-reactive, solvent-free, pure copolymer polyamide hot melt resin, specially designed for Low Pressure Moulding applications.
Product overview

Thermelt 865 is a high quality, non-reactive, solvent-free, pure copolymer polyamide hot melt resin, specially designed for Low Pressure Moulding applications.

It offers solutions for encapsulation of electronic parts in the automotive industry for external uses such as door locks and aerials.

Thermelt 865 was developed specifically for improving adhesion on a wide range of substrates and offers cohesiveness at negative temperatures (-40°C) 

Geographic availability
  • Asia Pacific
  • Oceania
  • Europe

Smart Advantages

 

Good adhesion on PVC and ABS plastics

Good brittleness resistance at negative temperatures: encapsulant remains flexible and does not break when exposed to cold

Complies with flammability standard UL94 V0: excellent flame-retardant properties