In the presence of Vincent Legros, Chairman & CEO of Bostik, the Regional Senior Vice Presidents of Bostik and Arkema, and Nara’s officials, a Shinto ground breaking ceremony (called ‘Jichin-sai’) has been organized in order to purify the future plant under the protection of local guardian god.
smart adhesives: Our lead technologies
The material sciences and lead technologies at the core of our innovations
As Bostik has expanded, diversified and innovated, our lead adhesive technologies have evolved with us, addressing the ever-changing needs of our customers.
Today we prioritize three distinct technology platforms: Elastic Bonding (EB), Hot Melt Pressure Sensitive Adhesives (HMPSA) and Polymer Modified Binders (PMB).
This focused expertise has allowed us to develop world-leading chemistries in these areas and a constant stream of smart bonding solutions.
Lead technology platforms
Elastic Bonding (EB)
Elastic bonds are a family of adhesives that join and seal two individual materials together, allowing for flexibility yet remain very strong.
Learn more about our elastic bonding adhesives
Hot melt pressure sensitive adhesives (HMPSA)
These adhesives provide instant bonds as they solidify by cooling, and remain permanently tacky.
Polymer modified binders (PMB)
Construction products based on polymer modified cementitious binders that provide strong adhesion, flexibility, crack resistance and durability.
Learn more about polymer-modified binders
Other Bostik technologies used in formulations
Acrylic, cyanoacrylate, ethylene-vinyl acetate (EVA), epoxy, olefin copolymer, polyamide, silicone, solvent-based, water-based.
Latest Posts
BOSTIK, OFFICIAL SUPPLIER OF THE TOUR DE FRANCE, DEVELOPS A NEW GENERATION OF TECHNICAL SOLUTION FOR CYCLE RACERS
Bostik, the specialty adhesives business line of the Arkema group, and A.S.O., organizer of the Tour de France, joins their forces for the third year in the row to improve the performance of cyclists with a new generation of adhesive bibs.
Vincent Legros, Chairman & CEO of Bostik, special guest of the 2019 DIY Summit in Ireland.
For the third time, Bostik will be sponsoring the annual Global DIY Summit. This event will be held in Dublin Ireland from 5 to 7 June 2019. The theme of this year’s conference is ‘DIY Evolution – Designing the future together’ and a big part of the conference sessions are focused on Innovation.
Read more Bostik Wins Tape Summit Award for Moisture-Cured Technology
Bostik was the proud recipient of the Best Poster Award during this year’s Innovative Poster Session at PSTC’s Tape Summit in Baltimore, MD.
Read More 