smart adhesives: Our lead technologies
The material sciences and lead technologies at the core of our innovations
As Bostik has expanded, diversified and innovated, our lead adhesive technologies have evolved with us, addressing the ever-changing needs of our customers.
Today we prioritize three distinct technology platforms: Elastic Bonding (EB), Hot Melt Pressure Sensitive Adhesives (HMPSA) and Polymer Modified Binders (PMB).
This focused expertise has allowed us to develop world-leading chemistries in these areas and a constant stream of smart bonding solutions.
Lead technology platforms
Elastic Bonding (EB)
Elastic bonds are a family of adhesives that join and seal two individual materials together, allowing for flexibility yet remain very strong.
Hot melt pressure sensitive adhesives (HMPSA)
These adhesives provide instant bonds as they solidify by cooling, and remain permanently tacky.
Polymer modified binders (PMB)
Construction products based on polymer modified cementitious binders that provide strong adhesion, flexibility, crack resistance and durability.
Other Bostik technologies used in formulations
Acrylic, cyanoacrylate, ethylene-vinyl acetate (EVA), epoxy, olefin copolymer, polyamide, silicone, solvent-based, water-based.
Bostik stays ahead of industry trends with the introduction of laminating PU adhesives free of GLYMO and other substances of concern.