smart adhesives: Our lead technologies

 

The material sciences and lead technologies at the core of our innovations

As Bostik has expanded, diversified and innovated, our lead adhesive technologies have evolved with us, addressing the ever-changing needs of our customers.

Today we prioritize three distinct technology platforms: Elastic Bonding (EB), Hot Melt Pressure Sensitive Adhesives (HMPSA) and Polymer Modified Binders (PMB).

This focused expertise has allowed us to develop world-leading chemistries in these areas and a constant stream of smart bonding solutions. 

Lead technology platforms

Elastic Bonding (EB)

Elastic bonds are a family of adhesives that join and seal two individual materials together, allowing for flexibility yet remain very strong. 

Learn more about our elastic bonding adhesives

 

Hot melt pressure sensitive adhesives (HMPSA)

These adhesives provide instant bonds as they solidify by cooling, and remain permanently tacky. 

Learn more about HMPSAs

 

Polymer modified binders (PMB)

Construction products based on polymer modified cementitious binders that provide strong adhesion, flexibility, crack resistance and durability.

Learn more about polymer-modified binders

 

Other Bostik technologies used in formulations

Acrylic, cyanoacrylate, ethylene-vinyl acetate (EVA), epoxy, olefin copolymer, polyamide, silicone, solvent-based, water-based.

The Bostik Smart House

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BOSTIK LAUNCHES Born2Bond™, A RANGE OF NEW ENGINEERING ADHESIVES

With Born2Bond™, Bostik brings a new range of innovative engineering adhesives designed for ‘by-the-dot’ bonding applications in selected industries, such as automotive, electronics, luxury packaging, medical devices, and MRO.
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Bostik launches a glymo-free laminating PU adhesives for food contact packaging

Bostik stays ahead of industry trends with the introduction of laminating PU adhesives free of GLYMO and other substances of concern.  

Event Details

BOSTIK-NITTA JV laid the foundations Of its new adhesives plant in Nara (JAPAN)

In the presence of Vincent Legros, Chairman & CEO of Bostik, the Regional Senior Vice Presidents of Bostik and Arkema, and Nara’s officials, a Shinto ground breaking ceremony (called ‘Jichin-sai’) has been organized in order to purify the future plant under the protection of local guardian god.
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BOSTIK, OFFICIAL SUPPLIER OF THE TOUR DE FRANCE, DEVELOPS A NEW GENERATION OF TECHNICAL SOLUTION FOR CYCLE RACERS

Bostik, the specialty adhesives business line of the Arkema group, and A.S.O., organizer of the Tour de France, joins their forces for the third year in the row to improve the performance of cyclists with a new generation of adhesive bibs.
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