Brands and countries
  • Product

CONDUCTIVE BUTYL 1160 BLACK

Hot melt butyl
SDS
Product overview
Thermoplastic hot melt sealant especially designed as a thermal bridge for refrigerators and deep freezers. Butyl 1160 can replace heat conductive pastes to improve heat exchange between the inner housing and heat exchanger. Additional mechanical fixation (taping) before foaming can be avoided. - Permanent plastic and permanent tacky - Good adhesion on almost all substrates - Solvent free (no shrinkage) - Form stable in subsequent foaming procedure
Available sizes
DRUM(S) 200 KG/P2
URL de l'image : Melt volume index MDM 53567-01.png
URL de l'image : Complex viscosity MDM 53567-01.png
Cleaning Remove main portions mechanically („dab off”). Residuals can be cleaned with Bostik Solvent 280 or white spirit.
Safety Instructions
  • Observe the standard hygienic precautions for chemical goods when working with Butyl 1160.
  • Do not eat, drink or smoke
  • Avoid contact with eyes and skin
  • Wash hands before breaks and after end of work
  • Contact with melt causes thermal burns

    FOR FURTHER INFORMATION PLEASE REFER TO OUR SAFETY DATA SHEET
Stability From -30°C to 90°C temperature and form stable. Butyl 1160 behaves thermoplastic: At low temperature the hardness increases, at high temperatures the mass becomes softer and tackier. Good aging resistance, especially under warm and humid conditions. Not resistant against oil, grease, white spirit and other solvents.
Storage Store under dry conditions, protect against mechanical deformation. Product is not affected by frost. Shelf life at least 24 months.
Adhesive Technology HM BUTYL SEALANT – profiles
Colors Black
Adhesion Good adhesion to a variety of different materials. In contact with plastic materials a migration of plasticizer may occur – we recommend to carry out tests before application! Surfaces must be dry and mostly clean, free of dust, oil or grease.
Chemical Base Synthetic rubber (IIR; PIB)
Density 1,10 – 1,30 g/ml Pycnometer; 23°C (similar to DIN EN ISO 2811-1)
Melt Index 40 – 70 ml/10 min 140°C;2,16 kg; 2 mm nozzle (similar to DIN EN ISO 1133-1)
Processing Butyl 1160 is applied by using common drum unloaders (temperature and pressure). The exact processing conditions have to be adjust for each equipment individually and depend on the substrates and line speed too (Your equipment manufacturer will assist you). For Butyl 1160 an application temperature range from 120°C to 150°C is recommended. A longer temperature load above 160°C has to be avoided (Risk of carbonization and decomposition).
Surface Track 3 - good 5 - excellent 4 - high 3 - good 2 - low 1 - minimal
Thermal Conductivity approx. 0,85 approx. 0,73 approx. 0,73 W/m¬∑K -40°C +20°C +80°C (ZAE heated wire method)
Smart Advantages
  • Very good heat conductivity
  • High peel strength
  • Improves productivity
Applications
  • Temporary fixation
  • Gap filling
  • Thermal bridge
Top