THERMELT 1005
Copolyamide hot melt resin
Product overview
Resin Thermelt 1005 is a pure copolyamide hot melt resin non-reactive and solvent free.
Available sizes
BAGS 20 KG/P50
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TDS
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SDS
Features | - Good adhesion on porous substrates - Fast setting time - Low temperature of application |
Applications | Resin Thermelt 1005 is mainly used for tile spacer and binder for inks (flexographic and heliographic) and paints. It shows a good solubility in alcohols and their blends with aliphatics or aromatics hydrocarbons. |
Key Features | - Good adhesion on porous substrates - Fast setting time - Low rep of application |
Adhesive Technology | HMPA |
Colors | Dark amber |
Density | ~1 internal_test |
Drying Temperature | 70.0 °C |
Drying Time | 2 – 4 h (Air oven, thin layer) |
Melt Temperature Range | 135 – 150 ¬∞C |
Processing Moisture Content | < 0.2 |
Softening Point | 115 °C |
Viscosity | 3.5 [Pa.s] |
Further Information | The following publication is available on request: - Safety Data Sheets (SDS) The information given and recommendations made herein are based on Bostik’s research only and are not guaranteed to be accurate. The performance of the product, its shelf life, and application characteristics will depend on many variables, including the kind of materials to which the product will be applied, the environment in which the product is stored or applied, and the equipment used for application. Any change in any of these variables can affect the product’s performance. It is the buyer’s obligation, prior to using the product, to test the suitability of the product for an intended use under the conditions that will exist at the time of the intended use. Bostik does not warrant the product’s suitability for any particular application. The product is sold pursuant to Bostik’s Terms and Conditions of Sale that accompanies the product at the time of sale. Nothing contained herein shall be construed to imply the nonexistence of any relevant patents or to constitute permission, inducement, or recommendation to practice any invention covered by any patent, without authority from the owner of the patent. |
Packaging | F or existing packaging sizes, please call your Bostik sales representative. |