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THERMELT 861 Natural

Copolyamide hot melt resin
SDS
Product overview
Resin Thermelt 861 natural is a pure copolyamide hot melt resin non-reactive and solvent free, specially designed for Low Pressure Molding applications.
Available sizes
BAGS 20 KG/P60
Features -Good wetting properties at application temperature
- A short open time and setting time
- Soft material
-A good fluidity at application temperature This resin is in accordance with UL 94 V0 class.
Applications Resin Thermelt 861 natural is mainly used for molding of electronic/electric components, connectors and cables.
Key Features - Good fluidity at application temperature
- Suitable for various applications
- Flammability UL94 : V0
Adhesive Technology HMPA
Colors Natural
Density ~1 internal_test
Drying Temperature 80.0 °C
Drying Time 6 h (Air oven, thin layer)
Melt Temperature Range 180 - 210 °C
Mold Temperature Range 20 - 60 °C
Processing Moisture Content < 0.2
Softening Point 159 °C
Viscosity 3.6 [Pa.s]
Further Information The following publication is available on request: - Safety Data Sheets (SDS)
-Regulatory Information Sheet (RIS) The information given and recommendations made herein are based on Bostik’s research only and are not guaranteed to be accurate. The performance of the product, its shelf life, and application characteristics will depend on many variables, including the kind of materials to which the product will be applied, the environment in which the product is stored or applied, and the equipment used for application. Any change in any of these variables can affect the product’s performance. It is the buyer’s obligation, prior to using the product, to test the suitability of the product for an intended use under the conditions that will exist at the time of the intended use. Bostik does not warrant the product’s suitability for any particular application. The product is sold pursuant to Bostik’s Terms and Conditions of Sale that accompanies the product at the time of sale. Nothing contained herein shall be construed to imply the nonexistence of any relevant patents or to constitute permission, inducement, or recommendation to practice any invention covered by any patent, without authority from the owner of the patent.
Packaging For existing packaging sizes, please call your Bostik sales representative.
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