THERMELT 867 Natural
Copolyamide hot melt resin
Product overview
Resin Thermelt 867 natural is a pure copolyamide hot melt resin, non reactive and solvent free, specially designed for Low Pressure Molding applications.
Available sizes
BAGS 20 KG/P50 PLASTIC
BAGS 20 KG/P50
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TDS
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SDS
| Features | -Good fluidity at application temperature -Wide temperature range of use, - Versatile product with good adhesion and cohesion. This resin is in accordance with UL 94 V0 class. |
| Applications | Resin Thermelt 867 natural is mainly used for molding of electronic/electric components, connectors and cables. |
| Key Features | - Wide temperature range of use - Suitable for various applications - Flammability UL94: V0 |
| Adhesive Technology | HMPA |
| Colors | Natural |
| Density | ~1 internal_test |
| Drying Temperature | 80.0 °C |
| Drying Time | 6 h (Air oven, thin layer) |
| Melt Temperature Range | 200-230 °C |
| Mold Temperature Range | 20-60 °C |
| Processing Moisture Content | < 0.2 |
| Softening Point | 183 °C |
| Viscosity | 3.5 [Pa.s] |
| Further Information | The following publication is available on request: - Safety Data Sheets (SDS) The information given and recommendations made herein are based on Bostik’s research only and are not guaranteed to be accurate. The performance of the product, its shelf life, and application characteristics will depend on many variables, including the kind of materials to which the product will be applied, the environment in which the product is stored or applied, and the equipment used for application. Any change in any of these variables can affect the product’s performance. It is the buyer’s obligation, prior to using the product, to test the suitability of the product for an intended use under the conditions that will exist at the time of the intended use. Bostik does not warrant the product’s suitability for any particular application. The product is sold pursuant to Bostik’s Terms and Conditions of Sale that accompanies the product at the time of sale. Nothing contained herein shall be construed to imply the nonexistence of any relevant patents or to constitute permission, inducement, or recommendation to practice any invention covered by any patent, without authority from the owner of the patent. |
| Packaging | For existing packaging sizes, please call your Bostik sales representative. |