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THERMELT 868 Black

Copolyamide hot melt resin
SDS
Product overview
Resin Thermelt 868 black is a pure copolyamide hot melt resin non-reactive and solvent free, specially designed for Low Pressure Molding applications.
Available sizes
BAGS 20 KG/P50
Features - Enhanced UV resistance compared to standard PA
- Light color product,
- Soft material
-A good fluidity at application temperature This resin is in accordance with UL 94 V0 class.
Applications Resin Thermelt 868 black is mainly used for molding of electronic/electric components, connectors and cables.
Key Features - Enhanced UV resistance versus standard PA
- Light color product
- Flammability UL94 : V0
Adhesive Technology HMPA
Colors Black
Density ~1 internal_test
Drying Temperature 80.0 °C
Drying Time 6 h (Air oven, thin layer)
Melt Temperature Range 180 - 210 °C
Mold Temperature Range 20-60 °C
Processing Moisture Content < 0.2
Softening Point 162 °C
Viscosity 3.6 [Pa.s]
Packaging F or existing packaging sizes, please call your Bostik sales representative.
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