THERMELT 868 Black
Copolyamide hot melt resin
Product overview
Resin Thermelt 868 black is a pure copolyamide hot melt resin non-reactive and solvent free, specially designed for Low Pressure Molding applications.
Available sizes
BAGS 20 KG/P50
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TDS
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SDS
Features | - Enhanced UV resistance compared to standard PA - Light color product, - Soft material -A good fluidity at application temperature This resin is in accordance with UL 94 V0 class. |
Applications | Resin Thermelt 868 black is mainly used for molding of electronic/electric components, connectors and cables. |
Key Features | - Enhanced UV resistance versus standard PA - Light color product - Flammability UL94 : V0 |
Adhesive Technology | HMPA |
Colors | Black |
Density | ~1 internal_test |
Drying Temperature | 80.0 °C |
Drying Time | 6 h (Air oven, thin layer) |
Melt Temperature Range | 180 - 210 °C |
Mold Temperature Range | 20-60 °C |
Processing Moisture Content | < 0.2 |
Softening Point | 162 °C |
Viscosity | 3.6 [Pa.s] |
Packaging | F or existing packaging sizes, please call your Bostik sales representative. |