Kizen® HEAT

    Kizen high temperature resistance hot melt case and carton sealing adhesive

    Key Features

    • Superior Temperature Resistance
    • Excellent resistance to hot fill and extreme shipping conditions 
    • Outstanding thermal stability and ultra-precise drops

    The Ideal High Temperature Resistance Option for Case and Carton Sealing Applications

    The newest addition to the Kizen product line, Kizen HEAT serves as the perfect complement to Kizen FORCE and Kizen ICE. Ideal for hot fill applications, Bostik’s latest next generation hot melt adhesive for case and carton sealing possesses a high heat resistance and the ability to withstand high temperature shipping conditions.

    Formulated with proprietary water-white technology, Kizen HEAT has passed the IOPP Method T-3006 Heat Resistance Under Stress test and has been approved for use in applications of at least 160°F (71°C) for 24 hours.

    In addition to offering superior bonds in high temperature environments, Kizen HEAT enables increased plant productivity, reduced adhesive use and improved packaging performance overall.

    For more information on how the Kizen product line can help your case and carton sealing needs, call our Smart Help Hotline at 800-726-7845 today, or visit www.bostik.com/us/kizen.

    Technical Data Sheet

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