Published on September 20, 2018
Bostik, a leading global adhesive specialist for industrial, construction and consumer markets, is preparing for an exciting 2018 PACK EXPO International tradeshow, October 14 through 17, at the McCormick Place in Chicago. Bostik will celebrate the debut of two new technologies, anti-fog heat seal coatings and the Kizen® HEAT hot melt adhesive, on stand E-8959 and will participate in the Innovation Stage educational platform.
The largest packaging event in the world, PACK EXPO International is expected to draw 50,000 attendees from all packaged goods industries. The show will host more than 2,500 exhibitors demonstrating the latest innovations and offer free educational opportunities. Attendees can also access the Healthcare Packaging Expo, another PMMI-produced event co-located with PACK EXPO.
Bostik’s new anti-fog heat seal coatings are a solution for condensation-prone clear, refrigerable packaging. The high-clarity, copolyester-based films allow for better branding and visibility of fresh produce and other high-moisture products. Packaging converters and designers benefit from production cost savings.
As part of the Innovation Stage, PACK EXPO attendees will be able to learn all about Bostik’s smart anti-fog product innovations in the session “Cutting Through the Fog: Solutions for High-Moisture, Refrigerated Products,” in booth N-4585 at 1:00pm on Monday, October 15. Senior Chemist Deepa Puthanparambil will explain how anti-fog coatings can help packaging companies stay ahead of consumer grocery shopping trends. She will also compare extrusion and solvent-applied materials and their benefits to the packaging industry.
The newest addition to Bostik’s Kizen family of hot melt adhesives for case and carton sealing, Kizen HEAT, will also be introduced at PACK EXPO. Formulated with proprietary water-white technology and designed for strong bond performance on a variety of substrates, Kizen HEAT is a low-maintenance hot melt adhesive that can improve productivity. Like the entire Kizen product line, it offers comfort, security and efficiency, along with a fast set speed and reliable closing.
To see these and more packaging innovations, visit Bostik’s booth E-8959 at PACK EXPO International, and attend the “Cutting Through the Fog: Solutions for High-Moisture, Refrigerated Products” Innovation Stage presentation at 1:00pm on October 15 in booth N-4585. More information about all of Bostik’s smart adhesive solutions can be found at www.bostik.com.