THERMELT 868 White
Copolyamide hot melt resin
Product overview
Resin Thermelt 868 white is a pure copolyamide hot melt resin non-reactive and solvent free, specially designed for Low Pressure Molding applications.
Available sizes
BAGS 20 KG/P50
BAGS 20 KG/P50
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TDS
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SDS
| Applications | Resin Thermelt 868 white is mainly used for molding of electronic/electric components, connectors and cables. |
| Key Features | - High resistance to external exposure - Excellent stability - Flammability UL94 : V0 (UL file E116659) |
| Adhesive Technology | HMPA |
| Colors | white |
| Density | ~1 internal_test |
| Drying Temperature | 80.0 °C |
| Drying Time | 6 h (Air oven, thin layer) |
| Melt Temperature Range | 190-210 °C |
| Mold Temperature Range | 20-60 °C |
| Processing Moisture Content | < 0.2 |
| Softening Point | 162 °C |
| Viscosity | 3.6 [Pa.s] |
| Packaging | F or existing packaging sizes, please call your Bostik sales representative. |