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KIZEN FORCE 2.0

KIZEN FORCE 2.0 is a 100% solid hot melt adhesive, it is used for case sealing and paperboard boxes, folding cartons, boxboard, etc.
Product overview
PROCESSING
− Recommended operation temperature: 130-180℃.
− The viscosity and setting time could be different during operation temperature changes.
− KIZEN FORCE 2.0 is not suggested to mix with any other type of adhesive.
− The cover of glue tank should be closed in case of any contamination.
− If the production were to stop for over 2 hours, the glue temperature should be turned down.
Geographic availability
  • Asia Pacific
  • Oceania

Smart Advantages

 
Quick setting
Good thermal stability
Excellent adhesion
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