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Hot melt resins for overmoulding electronics components 

With our low-pressure molding adhesives, based on polyamide hot melt technology, protecting electronic components is further simplified. They offer:

  • Easy processability at low pressure alongside compatibility with fragile components for streamlined operations and design flexibility 
  • Vibration and chemical resistance, including thermal cycling, fluids, high humidity and UV exposure for improved electrical insulation and performance overall 
  • Hot melt material with no mixing required, up to 80% bio-based formulation as well as allowing recyclability of injected material for reduced waste and environmental impact 


Featured product: TH 8672B

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Electronics Assembly

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