- Good adhesion on PVC and ABS plastics
- Good brittleness resistance at negative temperatures: encapsulant remains flexible and does not break when exposed to cold
- Complies with flammability standard UL94 V0: excellent flame-retardant properties
Polyamide hot melt resin for Low Pressure Molding applications
Thermelt 865 is a high quality, non-reactive, solvent-free, pure copolymer polyamide hot melt resin, specially designed for Low Pressure Moulding applications.
It offers solutions for encapsulation of electronic parts in the automotive industry for external uses such as door locks and aerials.
Thermelt 865 was developed specifically for improving adhesion on a wide range of substrates and offers cohesiveness at negative temperatures (-40°C)
TLH 2299 E is a hot melt pressure-sensitive adhesive used in the automotive industry for interior applications.
It is used for ...