Cutting edge adhesive solutions, driven by Arkema expertise
From a unique water-white hotmelt technology, Kizen™ have been designed for ease of use and strong bond performance for cardboard packaging. With Kizen, packaging manufacturers also experience the comfort, security and efficiency they deserve.
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Confort
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- Free flowing / Room temperature tack-free pellets
- Clean hoses and nozzles / Thermal stability
- Ultra precise drop / Clean cut adhesive
- Improved atmosphere / Low odour
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Security
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Reinforced supply availability and stability / Bostik integration to Arkema
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Fall prevention / Flat pellets
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Enhanced ergonomics / Light and easy prehension packaging
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Cleaner atmosphere / Low fuming
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Efficiency
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Minimal adhesive consumption / Coating weight reduction
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Increased productivity / Reduction of line stops and fast setting time
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Investment-free Plug & Play implementation / Excellent chemical compatibility
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More reliable closing / High performance bonds
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