Thermogrip® H1714
Bostik Thermogrip® H1714 is a low application temperature hot melt adhesive that is designed for case forming and sealing applications. It is clean running and offers very low application temperatures (ranging from 250 to 275˚F). Thermogrip® H1714 provides fiber-tearing bonds on many substrates, including some coated and recycled corrugate and other board stocks.
Call us at 1-800-726-7845 to learn more about Thermogrip® H1714 low temperature hot melt adhesive.
- Canada
- Low application temperature
- Clean running
- Fiber tearing bonds on a variety of board stocks
Low Temperature Hot Melt Adhesive
Bostik Thermogrip® H1714 is a low application temperature hot melt adhesive that is designed for case forming and sealing applications. It is clean running and offers very low application temperatures (ranging from 250 to 275˚F). Thermogrip® H1714 provides fiber-tearing bonds on many substrates, including some coated and recycled corrugate and other board stocks.
Call us at 1-800-726-7845 to learn more about Thermogrip® H1714 low temperature hot melt adhesive.