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H20060C

HOT MELT PRESSURE SENSITIVE ADHESIVE
Product overview
H20060C is a hot melt pressure sensitive adhesive, which is mostly suitable for tape applications. It has stable bonding performance at a high and low temperature.
Its high cohesion performance makes it more resistant to deformation, and has good removability on some substrates.
Geographic availability
  • Asia Pacific
  • Oceania

Smart Advantages

 
Excellent bonding performance
Wide operating temperature range
Good die-cutting performance

Related market & applications

Technologies

hmpsa

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