Bostik Worldwide

Bostik around the world

Cutting edge adhesive solutions, driven by Arkema expertise

From a unique water-white hotmelt technology, Kizen™ have been designed for ease of use and strong bond performance for cardboard packaging. With Kizen, packaging manufacturers also experience the comfort, security and efficiency they deserve.
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    • Free flowing / Room temperature tack-free pellets
    • Clean hoses and nozzles / Thermal stability
    • Ultra precise drop / Clean cut adhesive
    • Improved atmosphere / Low odour
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    • Reinforced supply availability and stability / Bostik integration to Arkema

    • Fall prevention / Flat pellets

    • Enhanced ergonomics / Light and easy prehension packaging

    • Cleaner atmosphere / Low fuming

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    • Minimal adhesive consumption / Coating weight reduction

    • Increased productivity / Reduction of line stops and fast setting time

    • Investment-free Plug & Play implementation / Excellent chemical compatibility

    • More reliable closing / High performance bonds

For your peace of mind, discover Kizen™ !