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Thermelt 865 is a high quality, non-reactive, solvent-free, pure copolymer polyamide hot melt resin, specially designed for Low Pressure Moulding applications.

It offers solutions for encapsulation of electronic parts in the automotive industry for external uses such as door locks and aerials.

Thermelt 865 was developed specifically for improving adhesion on a wide range of substrates and offers cohesiveness at negative temperatures (-40°C)