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H2284-01

H2284-01 is a hot melt pressure sensitive adhesive used in the Label market, especially in E-commerce & Logistics applications.
Product overview
H2284-01 is designed for EDP and piggyback die cut labels to corrugate at room temperature condition. It has excellent die cutting as well as high release value to solvent-less liner with high tack and peel.
Geographic availability
  • Oceania
  • Europe
  • Asia Pacific

Smart Advantages

 
Excellent die cutting: Enhanced workability during manufacturing process 
High release value: Provide easy opening at end-user 
High tack and peel: Ensured package security 

Latest news

Sep 02 2021
    Corporate Innovation

Bostik opens new state-of-the-art training facility

Bostik has opened the Bostik Academy, a brand new state-of-the-art training facility located at the ...

Read more
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