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Hot melt resins for overmoulding electronics components 

Our low-pressure molding adhesives, based on polyamide hot melt technology, further simplifies protecting electronic components. They offer:

  • Easy processability at low pressure alongside compatibility with fragile components for streamlined operations and design flexibility 
  • Vibration and chemical resistance, including thermal cycling, fluids, high humidity and UV exposure for improved electrical insulation and performance overall 
  • Hot melt material with no mixing required, up to 80% bio-based formulation as well as allowing recyclability of injected material for reduced waste and environmental impact 

 

Featured product: TH 8672B

Frequently Asked Questions about Low Pressure Molding Adhesives

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What is Low Pressure Molding?

Used to encapsulate electronic components, Low Pressure Molding (LPM) technology protects and seals items against moisture, dust, dirt, and debris. Simplified to a single and fast process, LPM is a cross between classic plastic injection and resin potting. This system is used at low pressure and low temperature. This protects the product and allows a lower equipment cost. It is ideal for connectors, onboard electronics, LEDs, and PCBs (Printed Circuit Boards). It is most often used with hot melt polyamide materials. 

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What are typical and key applications for Low Pressure Molding?

Typical applications are captors and sensors, PCB overmolding, connectors and cables, and antennas. LPM is used in various key markets, such as automotive, medical, electronics, smartphones, and other industrial areas.

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What are the benefits of Low Pressure Molding in terms of process?

LPM process is an alternative to classic high-pressure injection molding and resin potting. Low-pressure molding provides a small process footprint with lower energy consumption due to low injection pressure and the need for less equipment. It also offers high production speed with reduced cycled times with one-component product; immediate set with no mixing errors. Finally, it provides easier manufacturing with a simplified process.

question-mark-bostik-image.pngWhat are the benefits of Low-Pressure Molding in terms of sustainability?

Low-pressure molding avoids waste by avoiding excess material in comparison with traditional injection methods. Bostik also offers natural, solvent-free, and up to 80% biobased materials. Finally, this thermoplastic material can be melted and thus facilitate recycling, or be recycled itself for a better end-of-life management.

Do you need an expert to select the best adhesive for Low Pressure Molding, receive a technical data sheet, or request samples?

Contact us! 

Discover more about Electronics Assembly 

Electronics Assembly

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