SMP B-COMPONENT PLUS
SILYL MODIFIED POLYMER
Product overview
Bostik B-Component Plus is a paste like compound which is used as an accelerator to the curing process of Bostik SMP-based adhesives. (B-component Plus is part of the Bostik Dual SMP-system).
Available sizes
METAL DRUMS 20 L/P16
Smart Advantages
Controlled curing process
Faster bonding
Larger overlap designs possible
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Related market & applications
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