Low Pressure Molding Adhesives
Introducing Thermelt® for Low Pressure Molding Methods
For low pressure molding applications, Thermelt® is supplied as a hot melt polyamide resin that gets melted and injected into a mold to encapsulate electronic parts, including: 
- Connectors
- Onboard electronics
- Light-emitting diode (LED)
- Printed circuit boards
Thermelt low pressure molding technology also works well on low pressure molding equipment used for electronic components in luxury good, medical device, automotive, air and oil filtration and footwear markets.  
How Our Thermelt® Low Pressure Molding Technology Improves Sustainability
Low pressure molding materials inherently offer the ability to do skylining, which reduces product weight and size compared to other encapsulation methods and helps to decrease fuel consumption. With Bostik’s LPM hot melt polyamides, you can also:
- Eliminate harmful substances: Thermelt® is free from isocyanates and solvents.
- Reduce reliance on fossil fuels: This low pressure molding technology is formulated with up to 90% bio-based raw materials.
- Decrease energy usage: Thermelt® LPM resins offer 90-second cycle times.
- Lower risk of parts damage: The low pressure molding resins offer broad viscosity and temperature levels so that delicate parts can be encapsulated without damaging them and requiring addition material replacements.
How Our Thermelt® Low Pressure Molding Technology Improves End-Use Product Performance
These LPM hot melt polyamide resins also help improve overall performance by offering:
- Environmental resistance: Thermelt® resists temperatures (-40C to 130C), chemicals, water and UV.
- High electrical resistivity: Our low pressure molding technology provides good insulation of electronic parts for reliable thermal stability. 
- Sterilization resistance to meet ISO certification: Certain Thermelt® LPM resins have passed ISO certification tests to ensure the application can withstand autoclave testing (up to 50 cycles) as well as alcohol wiping and quick immersion. This certification also means reduced sensitization or irritation likelihood if in contact with skin. 
- UL 94 V-0 rating: These LPM resins self-extinguishes within 10 seconds when exposed to a flame.
Additionally, the Thermelt® range is available in different Tg and adhesion levels to help you find a solution that meets specific application performance requirements.  
Why Consider Bostik for Low Pressure Molding Technology
In addition to our Thermelt® LPM hot melt polyamides, when you choose Bostik, you receive:
- Extensive technical support: From trial testing to troubleshooting assistance, our team members consist of low pressure molding experts and specialists who can offer in-person support.
- Trial testing: We work with you to test your materials with our product range, helping to ensure they find the solution for performance needs.   
- Troubleshooting: We assist helping you operate efficiently with Thermelt® on your production lines. We also offer support with product training and using automated dispensing equipment properly.  
- Global sourcing: As the adhesive solutions segment of Arkema, we are vertically integrated to provide Thermelt® low pressure molding technology when and where it’s needed.
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