Bostik has announced it will sponsor and exhibit at this year’s IDEA®19 March 25 – 28, 2019 in Miami Beach, FL.
Bostik, a leading global adhesive specialist for industrial, construction and consumer markets, has announced it will sponsor and exhibit at this year’s IDEA®19 March 25 – 28, 2019 in Miami Beach, FL.
As the world’s preeminent event for nonwovens and engineered fabrics, IDEA brings together over 550 exhibitors and 7,000 attendees from around the globe, offering networking opportunities, an exhibit hall and short courses on the evolving nonwoven materials landscape.
A silver sponsor, Bostik’s Global Industrial Adhesives (GIA) and Global Disposable Hygiene business units will exhibit innovative adhesive solutions designed to meet diverse application needs across markets. Featured GIA products at IDEA include the company’s web, film and hot melt adhesive technologies ideal for upholstery, mattress, disposable garment and lamination applications. Offering flame retardancy, versatile bonding capabilities and a range of set speeds and application temperatures, these adhesives improve operational efficiencies and end-use product performance while increasing safety, enhancing sustainability and reducing overall costs.
Disposable Hygiene producers can visit Bostik’s booth to test their own “superpowers” as part of the “Superpower Challenges”. Bostik’s experts will share some of the tools used to understand and predict product performance, which has given them the knowledge and insight to formulate award-winning, world’s first technology called Brilliance™.
Speaking in advance of the show, Derek Hofsess, Business Development Engineer for GIA said, “IDEA is an incredible and unique opportunity to meet industry professionals spanning the nonwoven materials supply chain. Alongside our GNW counterparts, we look forward to learning more about their current and future needs and showing how our innovative solutions can address them.”
To register for IDEA, visit www.idea2019.com/register.html, and be sure to visit Bostik in booth 2006.