This product, supplied in solid form, can be applied with a drum melting system or a bulk melter. Once dispensed, the adhesive will react with ambient moisture or water content of the substrates to yield a cross-linked thermoset adhesive. Heat is not required during the curing step. Supergrip 98 has been developed for wood-wrapping & rigid panel bonding application.
Medium open-time: increase process efficiency
High green strength: improve bonding performance
Adhesion on a wide range of substrates: increase design opportunities