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Smart adhesives for EV electronic component encapsulation

With our EV electronic component encapsulation adhesives, this is easy. Based on hot melt and UV cyanaocrylate technologies, these solutions are ideal for both low pressure molding processes and conformal coating applications, offering:

  • Easy processability at low pressure and temperatures due to low viscosity for improved productivity
  • One-component formulations to reduce error likelihood and keep lines moving
  • High resistance to temperatures and non-polar fluids, including oil and alkali for enhanced performance in demanding environments
  • Delicate encapsulation capabilities due to low pressure to enable encapsulation for the most sensitive electronics
  • High compatibility with difficult substrates for increased design opportunities

Featured Product: Thermelt 865

Featured Product: Born2Bond™

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