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Kizen™ HEAT

Ideal for hot filling application, end of line packaging, including case and carton sealing and tray erecting, Kizen HEAT is the high temperature resistant hot melt adhesive in the Kizen product line that enables adhesive savings and improves plant efficiency.
Product overview

· Resists to thermal shock and temperature variations from 0°C to 80°C.
· Fast set speeds and adhesion to a variety of packaging substrates.
· Outstanding thermal stability, aiding in low maintenance, char-free operations, low fuming.
· Tailored rheology, which facilitates ultra-precise application and clean cut off.
· Low viscosity and excellent specific adhesion enable strong bonds.
· Enables low adhesive consumption compared to market standards (save 20-30% resources) thanks to improved rheological behavior.
· Recycle-ready
· Food safety compliant

Geographic availability
  • Europe

Smart Advantages

 

Minimal adhesive consumption

Heat resistant hot melt adhesive

Improves plant productivity

Latest news

Sep 02 2021
    Corporate Innovation

Bostik opens new state-of-the-art training facility

Bostik has opened the Bostik Academy, a brand new state-of-the-art training facility located at the ...

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Bostik-UK-News-Bostik-Academy-Opening-640x408.jpg
Jul 26 2021
    Corporate Innovation Social Responsability

 Webinar available now - R&D Perspectives on developing innovative adhesives for sustainable packaging

As part of the sustainable packaging summit, Benoît Pollacchi, Global R&D ...

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