Kizen™ HEAT
· Resists to thermal shock and temperature variations from 0°C to 80°C.
· Fast set speeds and adhesion to a variety of packaging substrates.
· Outstanding thermal stability, aiding in low maintenance, char-free operations, low fuming.
· Tailored rheology, which facilitates ultra-precise application and clean cut off.
· Low viscosity and excellent specific adhesion enable strong bonds.
· Enables low adhesive consumption compared to market standards (save 20-30% resources) thanks to improved rheological behavior.
· Recycle-ready
· Food safety compliant
- Europe
Smart Advantages
Minimal adhesive consumption
Heat resistant hot melt adhesive
Improves plant productivity
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