SL C955 ADVANCED
High-performance smoothing compound suitable for applications without priming, including over old adhesive residues
Product overview
Bostik SL C955 ADVANCED is a two-part, high-performance smoothing compound that doesn’t require intensive subfloor preparation – saving you both time and money!
With exceptional flow characteristics, it can be applied directly to most common substrates without priming due to its high adhesion and low shrinkage properties, including old adhesive residues, ceramic tiles, Bostik damp proof membranes, flooring grade plywood, and resin flooring.
It’s unaffected by moisture, meaning it can be used over damp subfloors prior to the application of a damp proof membrane, and can be applied from 2mm to 30mm in a single application when bulked out with a suitable aggregate.
It has a fast walk-on time of two hours, while floor coverings can be laid in as little as four hours under good ambient drying conditions. The smoothing compound is specially formulated to be used in conjunction with waterborne underfloor heating systems and can also be used to encapsulate electric cable type heating.
With exceptional flow characteristics, it can be applied directly to most common substrates without priming due to its high adhesion and low shrinkage properties, including old adhesive residues, ceramic tiles, Bostik damp proof membranes, flooring grade plywood, and resin flooring.
It’s unaffected by moisture, meaning it can be used over damp subfloors prior to the application of a damp proof membrane, and can be applied from 2mm to 30mm in a single application when bulked out with a suitable aggregate.
It has a fast walk-on time of two hours, while floor coverings can be laid in as little as four hours under good ambient drying conditions. The smoothing compound is specially formulated to be used in conjunction with waterborne underfloor heating systems and can also be used to encapsulate electric cable type heating.
Geographic availability
- United Kingdom
Colors available
Grey
Smart Advantages
No priming - can be applied directly to most common substrates
Exceptional flow characteristics
Moisture tolerant - can be used prior to application of a damp proof membrane
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TDS
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SDS B
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EPD
- No priming - can be applied directly to most common substrates
- Exceptional flow characteristics
- Moisture tolerant - can be used prior to application of a damp proof membrane
- Long wet edge
- Can be applied from 2mm to 30mm in a single pour, when bulked out with a suitable aggregate
- Suitable for use with water and electric underfloor heating systems
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SL C955 ADVANCED
High-performance smoothing compound suitable for applications without priming, including over old adhesive residues
