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Thermogrip® H1714

Low Temperature Hot Melt Adhesive
Product overview

Bostik Thermogrip® H1714 is a low application temperature hot melt adhesive that is designed for case forming and sealing applications. It is clean running and offers very low application temperatures (ranging from 250 to 275˚F). Thermogrip® H1714 provides fiber-tearing bonds on many substrates, including some coated and recycled corrugate and other board stocks.

Call us at 1-800-726-7845 to learn more about Thermogrip® H1714 low temperature hot melt adhesive.

Geographic availability
  • United States of America

Smart Advantages

 
Low application temperature
Clean running
Fiber tearing bonds on a variety of board stocks

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