Thermally Conductive Gap Fillers

At Bostik, we have two technical approaches:

• 1K non-reactive gap filler offers protection for automated processing that’s scalable for high volume production. As a non-curing, silicone-free solution, 1K gap filler offers an excellent ratio between thermal conductivity and density to help prevent air from causing hot spots. This non-hazardous, VOC-free option provides reworkability and ease of dismantling with low oil separation (~0,3%)* over the battery’s lifetime, providing long-term stability.
• 2K SMP gap filler provides high volume dispensing and fast compressing due to optimized viscosity levels. Further, its viscosity increases five times after 90 minutes at 35°C*. Usable for bead applied, automated processes with applications times less than a minute, this option is silicone-free with no VOCs to reduce your environmental footprint. It provides easy processing with low compression forces.

^{*based on internal testing}