Bostik announced it will make its debut at The Assembly Show October 22 – 24, 2019 in Chicago, IL, featuring a range of innovative adhesive solutions for electronic and microassembly applications and showcasing a live low pressure molding assembly demonstration with its partner, LPMS.
Bostik announced it will make its debut at The Assembly Show October 22 – 24, 2019 in Chicago, IL, featuring a range of innovative adhesive solutions for electronic and microassembly applications and showcasing a live low pressure molding assembly demonstration with its partner, LPMS.
Marking its 7th year, The Assembly Show focuses exclusively on assembly technology equipment and products. Bringing together thousands of industry professionals worldwide, the event offers educational opportunities and hands-on learning in addition to its vast exhibit hall of the latest innovations.
Exhibiting at The Assembly Show for the first time, Bostik will launch its new line of instant engineering adhesives for electronic and microassembly applications, Born2Bond. Designed to increase production efficiencies, enhance aesthetics and improve sustainability, these solutions combine the strength of a structural adhesive with the speed of an instant adhesive, possessing a dual cure system bond-on-demand formulations.
Additionally, Bostik is proud to showcase a live demonstration with its partner LPMS. During the show, attendees can watch firsthand how easy it is to waterproof their parts using LPMS’ Beta 300 equipment and Bostik’s low pressure molding solutions.
Further, Bostik will feature its line of methyl methacrylate structural adhesives, silyl modified polymer products and anti-seize and lubricating compounds, all designed to improve operational efficiencies and enhance end-use product performance overall.
Speaking in advance of the event, Christos Karadimas, Bostik’s Engineering Adhesive Business Development Director – Americas, said, “We are excited to make our debut at The Assembly Show this year and have a lot to offer attendees, as we introduce our new Born2Bond Instant products and showcase a live LPM demo with our partner, LPMS. I look forward to speaking with other industry professionals about their bonding needs and finding a solution together.”
Request a meeting today, and be sure to stop by Bostik and LPMS in booth 2049 to learn more about how these innovative solutions can improve your application processes and end-use products overall.