Cutting edge adhesive solutions, driven by Arkema expertise
From a unique water-white hotmelt technology, Kizen™ have been designed for ease of use and strong bond performance for cardboard packaging. With Kizen, packaging manufacturers also experience the comfort, security and efficiency they deserve.
- Free flowing / Room temperature tack-free pellets
- Clean hoses and nozzles / Thermal stability
- Ultra precise drop / Clean cut adhesive
- Improved atmosphere / Low odour
- Reinforced supply availability and stability / Bostik integration to Arkema
- Fall prevention / Flat pellets
- Enhanced ergonomics / Light and easy prehension packaging
- Cleaner atmosphere / Low fuming
- Minimal adhesive consumption / Coating weight reduction
- Increased productivity / Reduction of line stops and fast setting time
- Investment-free Plug & Play implementation / Excellent chemical compatibility
- More reliable closing / High performance bonds
For your peace of mind, discover Kizen™ !