H20060C
                    HOT MELT PRESSURE SENSITIVE ADHESIVE
        
                Product overview
                
            
                    H20060C is a hot melt pressure sensitive adhesive, which is mostly suitable for tape applications. It has stable bonding performance at a high and low temperature.
Its high cohesion performance makes it more resistant to deformation, and has good removability on some substrates.
                
                Its high cohesion performance makes it more resistant to deformation, and has good removability on some substrates.
                Geographic availability
                
                    
                
        - Asia Pacific
- Oceania
Smart Advantages
                            Excellent bonding performance
                    
                            Wide operating temperature range
                    
                            Good die-cutting performance
                    Related market & applications
Technologies
 
                     
             
             
             
             
             
             
             
             
            