TH 2157
TH 2157 is a hot melt adhesive used in the building material market such as membrane lamination.
Product overview
TH 2157 can be applied at temperature around 170-190°C depending on application system and substrate.
Geographic availability
- Asia Pacific
- Europe
- Oceania
Smart Advantages
Good wettability at application temperature: enhanced insulation performances.
No curing phase: improved line speeds.
Optimal adhesion on many substrates: adhesion versatility.
Related market & applications
Technologies
