Bostik, a leading global adhesive specialist for industrial, construction and consumer markets, will exhibit a range of innovative bonding and sealing solutions, including its low pressure molding, hot melt polyurethane, silyl modified polymer (SMP), methyl methacrylate (MMA) and Born2Bond™ engineering adhesives ideal for product assembly applications at this year’s Assembly Show in Rosemont, IL at the Donald E. Stephens Convention Center, October 25 – 27, 2022.
Celebrating its tenth year, The Assembly Show will bring together thousands of attendees and hundreds of exhibitors from around the world to highlight the latest assembly products and innovative technologies. Attendees will connect with experienced professionals and gain insight from industry experts on new developments and materials to enhance their assembly processes. This year’s event includes opportunities to experience new equipment, listen to expert speakers, attend award programs and network with others in the industry.
At the show, Bostik’s featured solutions will include a large portfolio of adhesives and sealant solutions for durable goods markets. This includes low-pressure molding adhesives, based on polyamide hot melt technology, which protect electronic components from moisture, dirt and other debris. Offering vibration and chemical resistance, these adhesives do not require mixing, streamlining operations for fragile components. Additionally, Bostik will showcase its hot melt polyurethane adhesives that maximize electronic assembly performance with high environmental resistance. The company also will feature its silyl modified polymer (SMP) products, which provide elastic properties ideal for products used in harsh conditions where flexibility is needed, as they will not peel or crack under stress. These products are also primerless, which increases manufacturing efficiencies and reduces error likelihood. Visitors will also learn about Bostik’s methyl methacrylate (MMA) solutions, which feature multi-substrate compatibility even to composites, to increase design options and high thixotropic, non-sag formulations to improve performance.
Additionally, Bostik will exhibit Born2Bond™ instant and anaerobic engineering adhesives, which offer high-performance adhesion on a variety of surfaces such as plastics, steel and woods. In particular, the company’s instant adhesives enable easy assembly processes for increasingly smaller applications, such as electronics, and possess low odor and low blooming for improved worker safety and enhanced aesthetics. Bostik’s anaerobic adhesives will be on display and are designed to create safe, easy and effective bonding solutions for workers with a unitizing bond through threadlocking, pipe sealing, gasketing and retaining compounds.
“Our Bostik team continually works to identify how our adhesive and sealant technologies can simplify assembly processes and offer maximum performance all at once,” said Maggie McKenney, Senior Technical Service Engineer. “We love showing the international audience at The Assembly Show how our adhesives and sealants provide a wide span of markets with environmentally-friendly, fast-setting advantages.”
There is still time to register for The Assembly Show to learn about the latest trends and technological advances. Make sure to visit the Bostik team at booth #245!