Electronics assembly AdhesiveS
Bostik offers a variety of high performance adhesive products for electronics applications in the assembly market.
From specialty wire-coating and coil encapsulation to audio component assembly and mounting, these adhesive products for electronics are durable, versatile and strong.
Bostik’s adhesive products are also specially formulated with low pressure molding, which protects electronics against moisture, dust, dirt and vibration. This ensures the adhesive products are encapsulated and environmentally protected.
The types of Bostik adhesive products used for electronics in the assembly market include liquid urethanes, hot melt polyurethanes and MS-polymer based sealants.
Electronic assembly adhesive - featured products
Some of the adhesive products Bostik offers for electronics applications include HBTSEPS74, a solvent borne, two-component polyurethane cross-linking system designed for film to foil lamination.
Another adhesive product for electronics applications is JB763, which is a pressure sensitive acrylic emulsion with a high peel and relatively low tack. This product also features good shear strength and excellent UV stability.