Adhesive Residue Encapsulator
Bostik Multi-Lock™ is a solvent-free, water-based, acrylic adhesive specifically formulated for the installation of most resilient flooring in residential and commercial applications.
Multi-Lock™ is a 0-VOC formulation as calculated by SCAQMD Rule 1168. It displays tenacious early bond strength and is specially formulated to be highly resistant to plasticizer migration. Multi-Lock™ has been formulated to exhibit a unique combination of application properties including excellent trowelability, fast tack/grab, low odor and easy clean up.
Multi-Lock™ may be used to adhere:
It may be used over all properly prepared substrates common to interior resilient flooring installations including:
Multi-Lock™ has 0 VOC’s (as calculated per SCAQMD Rule 1168), and may contribute toward LEED® credits under LEED® v4 Credits: IEQ Credit 2.1 and IEQ Credit 2.2.