Application Segment Panel & Insulation
PanelTack™ is your warranty to a carefree solution for wall panel, façade cladding systems and the bonding of external insulation façade system panels. Bostik has been a leader in the field of wall cladding and panel bonding with the PanelTack™ system for more than 30 years, with proven performance to highlight our knowledge, experience, and innovation on a global scale.
Wall cladding has gained popularity in recent years for:
- Energy-saving benefits
- The ease, speed and cleanliness of installation
- A seamless aesthetic look
The adhesive system prevents the panels from sagging under their own weight, and they absorb cyclical expansion and contraction due to environmental changes, such as wind, temperature, and humidity. Wall panel and façade cladding materials such as gauged porcelain tile panels, high-pressure laminate (HPL), aluminium composite materials (ACM), pressed mineral wool (PMW), fiber cement boards (FCB), porcelain, ceramic, concrete, porous substrates and other materials, to name just a few, are able to absorb wind loads and ensure a lasting bond under extreme conditions.
For bonding insulating façade panels to walls, Bostik is offering an unique set of products that are ETA 004:2000 tested and certified, meaning that Bostik’s adhesives foams can be used as insulation board adhesive without the use of mechanical fixings. Cost and time saving.
Support & Explanation
Paneltack is a moisture-curing, elastic adhesive on a base from SMP. Paneltack is also solvent and isocyante free. Bonding panels can be used for wall cladding, cuffs, roof and gutter edges, ceilings, dormers and pui and frame fillings.
The product characteristics and performance of all these products is developed and optimised in close cooperation with professionals of this branche. This is to ensure that you can apply a high quality product in the most convenient way with maximum results.
Our technical representatives are always available for you for technical questions and product recommendations.
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