Low Pressure Molding
Adhesives
Hot melt resins for overmoulding electronics components
With our low-pressure molding adhesives, based on polyamide hot melt technology, protecting electronic components is further simplified. They offer:
- Easy processability at low pressure alongside compatibility with fragile components for streamlined operations and design flexibility
- Vibration and chemical resistance, including thermal cycling, fluids, high humidity and UV exposure for improved electrical insulation and performance overall
- Hot melt material with no mixing required, up to 80% bio-based formulation as well as allowing recyclability of injected material for reduced waste and environmental impact