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1K-LF 196

1K-LF 196 is a solvent free moisture-curing one component laminating resin used in the flexible lamination market such as paper-lidding laminates.
Product overview
It is designed for the lamination of paper, cardboard or parchment against plastic, aluminum foil or metallized films. The surfaces to be bonded may be printed, unprinted or metalized.  
Geographic availability
  • Worldwide

Smart Advantages

 
Quick lamination speed: Improved productivity 
Low coating weight: Reduced cost-in-use 
High thermal resistance: Extended product durability 

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