Join us for an exclusive session where we will delve into the innovative solutions that can help protect electronic components across various end-use markets, including vehicles, medical devices, and cables. Our focus will be on addressing challenges such as moisture, chemical exposure, high temperatures, design limitations, and production cycle time, while improving performance and reducing environmental impact.
Our speakers for this event
Slide 1 of 3
Arnau PEJOAN
Business Development Manager, Engineering Adhesives
Paul REGAZZONI
R&D Technical Support Engineer, Engineering Adhesives
Sarah DUPE
Technical Service Engineer, Bostik
Discover Bio-Based Hot Melt Polyamides for Low Pressure Moulding
- When?
20/05/2025 at 13:30 UTC