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Introducing Kizen:

Next Generation of Hot Melt Adhesives for Case and Carton Sealing

In today’s fast-paced world, packaging production lines face a range of issues on a daily basis.

From nozzle clogging and pop-opens to tracking multiple SKUs, plants’ productivity levels can be negatively impacted as a result. 

Fortunately, a new case and carton sealing technology helps eliminate these issues, enabling plants reduce downtime and more easily meet high production demands – with just one adhesive.

Based on a water-white technology, Kizen® is designed for ease of use and strong bond performance on case and carton sealing applications.

With Kizen®, packaging manufacturers experience the comfort, security and efficiency they deserve.

Designed for peace of mind.

Comfort

  • "Plug & Play" switch / Excellent chemical compatibility

  • Free flowing / Room temperature tack-free pellets

  • Clean hoses and nozzles / Thermal stability

  • Ultra precise drop / Clean cut adhesive

  • Improved atmosphere / Low odor

Security

  • Reinforced supply availability and stability / Bostik integration to Arkema

  • Fall prevention / Flat pellets

  • Enhanced ergonomics / Light and easy prehension packaging

  • Cleaner atmosphere / Low fuming

Efficiency

  • Minimal adhesive consumption / Coating weight reduction

  • Increased productivity / Reduction of line stops and fast setting time

  • Investment-free "Plug & Play" implementation / Excellent chemical compatibility

  • More reliable closing / High performance bonds

WANT TO ACHIEVE SUSTAINABLE SAVINGS?

Explore your savings potential for cardboard bonding applications with our smart hot melt adhesive savings calculator.

CALCULATE your savings.

Discover more about Kizen®

Blog: Improve Packaging Plant and Production Lines

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Brochure: Kizen® Next Generation Hot Melt Adhesives

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Case Study: Reduce Pop-Opens and Improve Case & Carton Sealing

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Get started with Kizen® Today

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