Our main brands

Bostik Worldwide

Bostik around the world

Based on a water-white technology, Kizen™ is designed for ease of use and strong bond performance on case and carton sealing applications.

With Kizen™, packaging manufacturers experience the comfort, security and efficiency they deserve.


  • "Plug & Play" switch / Excellent chemical compatibility

  • Free flowing / Room temperature tack-free pellets

  • Clean hoses and nozzles / Thermal stability

  • Ultra precise drop / Clean cut adhesive

  • Improved atmosphere / Low odour


  • Reinforced supply availability and stability / Bostik integration to Arkema

  • Fall prevention / Flat pellets

  • Enhanced ergonomics / Light and easy prehension packaging

  • Cleaner atmosphere / Low fuming


  • Minimal adhesive consumption / Coating weight reduction

  • Increased productivity / Reduction of line stops and fast setting time

  • Investment-free "Plug & Play" implementation / Excellent chemical compatibility

  • More reliable closing / High performance bonds

Looking for peace of mind ? Discover how to gain comfort, security and efficiency with Kizen™.


Use our smart hotmelt adhesive savings calculator and get a first estimate of your savings in your cardboard bonding application.

Try it now!