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KEY BENEFITS

  • Relieve tensions
  • Stabilizes installation
  • Easy to cut and install
  • Very low emissions (EC 1 certified)

CHARACTERISTICS

  • Composition: Premium polyester fleece.
  • Format: Precision-cut boards measuring $0.6 \times 1\text{m}$.
  • Available Thicknesses:
    • RENO U504: 4 mm.
    • RENO U509: 9 mm.
    • RENO U515: 15 mm.
  • Acoustic Performance (Impact Sound Improvement):
    • 4 mm and 9 mm: 10 dB.
    • 15 mm: 13 dB.
  • Weight & Density :
    • 4 mm: 3.8 kg/m².
    • 9 mm: 7.2 kg/m².
    • 15 mm: 12 kg/m².

Decoupling underlayment boards for multiple substrates

These decoupling underlayment boards are compatible with a wide range of common construction substrates, including:

  • Concrete and cementitious screeds
  • Calcium sulphate screeds
  • Mastic asphalt screeds
  • Existing ceramic tiles and natural stone
  • Wooden and metallic substrates

This versatility makes them particularly effective as decoupling boards for concrete floors, ensuring reliable performance across varied site conditions.

Underlay for ceramic tiles and floor coverings

RENO MULTIBOARD systems function as an underlay for ceramic tiles, providing a stable base prior to tile installation. Once bonded to the substrate using suitable adhesives, tiles can typically be installed after curing, supporting efficient project timelines.

They are also suitable for:

  • Parquet and laminate flooring
  • Engineered and solid wood floors
  • Soft floor coverings (with levelling compound overlay)

Application process: RENO U504 / U509 / U515 MULTIBOARD

Quick Application Steps (On-Site Guide)

  • Prepare: Ensure subfloor is clean, level, dry and primed if required
  • Adhesive: Apply suitable Bostik adhesive evenly to the substrate
  • Install: Lay boards into adhesive, press firmly and avoid cross joints
  • Secure: Tape joints and maintain perimeter gaps
  • Finish: Install flooring or levelling layer after ~24 hours

1. Subfloor preparation

A properly prepared base is essential for board performance:

  • Substrate must be sound, dry and free from contaminants such as dust, grease or oil
  • Remove weak layers, coatings and adhesive residues using mechanical preparation
  • Vacuum thoroughly to eliminate loose material
  • Timber substrates must be stable and securely fixed
  • Smooth or dense surfaces should be mechanically abraded and degreased
  • Uneven substrates must be levelled prior to board installation
  • Weak or dusty surfaces may require consolidation with a suitable primer

All substrates should comply with site standards before installation begins.

2. Installation preparation

  • Acclimatise boards at room temperature for at least 24 hours before use
  • Select appropriate adhesive depending on floor type (e.g. MS, PU or tile adhesive)
  • Apply adhesive evenly using the correct notched trowel
  • Do not spread more adhesive than can be covered within working time

Important: Ensure full adhesive transfer to the underside of the boards.

3. Installation

  • Lay boards directly into the adhesive bed and press down firmly
  • Avoid aligning joints (stagger boards to prevent cross joints)
  • Cut boards as required using a knife or saw
  • Maintain perimeter gaps to prevent sound bridging
  • Use a roller or firm pressure to ensure proper bonding
  • Once installed, secure joints with tape to prevent ingress of levelling compounds or adhesives

Designed to provide decoupling, sound reduction and thermal insulation beneath floor finishes.

4. Finishing & curing

  • Allow adhesive to cure before proceeding (~24 hours depending on system)

Typical next steps:

  • Tiles: install directly after curing
  • Wood flooring: install once boards are bonded
  • Soft flooring: apply 3–6 mm levelling compound before final finish

5. Underfloor heating

  • Switch off heating systems 48 hours before, during, and for at least 48 hours after installation
  • Gradually bring heating back to operating temperature after installation

Common mistakes to avoid

  • Installing onto uneven or unprepared substrates
  • Poor adhesive coverage leading to hollow spots
  • Aligning board joints (creating weak points)
  • Not maintaining perimeter gaps (risk of sound bridging)
  • Skipping joint taping before applying levelling compounds
  • Applying excessive adhesive beyond working time
  • Ignoring acclimatisation period prior to installation

A complete underlayment solution for modern flooring systems

The RENO MULTIBOARD systems provide a comprehensive underlayment solution for construction professionals seeking performance, reliability and ease of installation across a wide range of flooring applications.

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